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AD85561 P120A DB104 R2A20115 UPD8880 P3484 5C180 P2003
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  ? 2006 ixys all rights reserved symbol test conditions maximum ratings v dss t j = 25 c to 175 c 150 v v dgr t j = 25 c to 175 c; r gs = 1 m ? 150 v v gs continuous 20 v v gsm transient 30 v i d25 t c = 25 c 150 a i d(rms) external lead current limit 75 a i dm t c = 25 c, pulse width limited by t jm 340 a i ar t c = 25 c60a e ar t c = 25 c80mj e as t c = 25 c 2.5 j dv/dt i s i dm , di/dt 100 a/ s, v dd v dss , 10 v/ns t j 175 c, r g = 4 ? p d t c = 25 c 714 w t j -55 ... +175 c t jm 175 c t stg -55 ... +175 c t l 1.6 mm (0.062 in.) from case for 10 s 300 c t sold plastic body for 10 s 260 c m d mounting torque 1.13/10 nm/lb.in. weight to-3p 5.5 g to-264 10 g g = gate d = drain s = source tab = drain ds99299e(03/06) symbol test conditions characteristic values (t j = 25 c, unless otherwise specified) min. typ. max. bv dss v gs = 0 v, i d = 250 a 150 v v gs(th) v ds = v gs , i d = 250 a 3.0 5.0 v i gss v gs = 20 v dc , v ds = 0 100 na i dss v ds = v dss 25 a v gs = 0 v t j = 175 c 500 a r ds(on) v gs = 10 v, i d = 0.5 i d25 13 m ? pulse test, t 300 s, duty cycle d 2 % polarht tm power mosfet n-channel enhancement mode avalanche rated features l international standard packages l unclamped inductive switching (uis) rated l low package inductance - easy to drive and to protect advantages l easy to mount l space savings l high power density to-264 (ixtk) g d s (tab) to-3p (ixtq) g d s d (tab) v dss = 150 v i d25 = 150 a r ds(on) 13 m ? ? ? ? ? ixtk 150n15p ixtq 150n15p
ixtk 150n15p ixtq 150n15p ixys reserves the right to change limits, test conditions, and dimensions. symbol test conditions characteristic values (t j = 25 c, unless otherwise specified) min. typ. max. g fs v ds = 10 v; i d = 0.5 i d25 , pulse test 55 80 s c iss 5800 pf c oss v gs = 0 v, v ds = 25 v, f = 1 mhz 1730 pf c rss 400 pf t d(on) 30 ns t r v gs = 10 v, v ds = 0.5 v dss , i d = i d25 33 ns t d(off) r g = 3.3 ? (external) 100 ns t f 28 ns q g(on) 190 nc q gs v gs = 10 v, v ds = 0.5 v dss , i d = 0.5 i d25 40 nc q gd 105 nc r thjc 0.21 c/w r thck to-3p 0.21 c/w r thcs to-264 0.15 c/w source-drain diode characteristic values (t j = 25 c, unless otherwise specified) symbol test conditions min. typ. max. i s v gs = 0 v 150 a i sm repetitive 340 a v sd i f = i s , v gs = 0 v, 1.5 v pulse test, t 300 s, duty cycle d 2 % t rr i f = 25 a 150 ns -di/dt = 100 a/ s q rm v r = 100 v, v gs = 0 v 2.3 c ixys mosfets and igbts are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 b1 6,683,344 6,727,585 one or moreof the following u.s. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 b1 6,534,343 6,710,405b2 6,759,692 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 b1 6,583,505 6,710,463 6,771,478 b2 to-3p (ixtq) outline to-264 (ixtk) outline
? 2006 ixys all rights reserved ixtk 150n15p ixtq 150n15p fig. 2. extended output characteristics @ 25 o c 0 30 60 90 120 150 180 210 240 270 300 330 012345678910 v d s - volts i d - amperes v gs = 10v 7v 6v 8v 9v fig. 3. output characteristics @ 150 o c 0 30 60 90 120 150 012 345 v d s - volts i d - amperes v gs = 10v 9v 8v 5v 6v 7v fig. 1. output characteristics @ 25 o c 0 30 60 90 120 150 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 v d s - volts i d - amperes v gs = 10v 9v 8v 7v 6v 5v fig. 4. r ds(on ) norm alized to 0.5 i d25 value vs. junction tem perature 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 -50 -25 0 25 50 75 100 125 150 175 t j - degrees centigrade r d s ( o n ) - normalize d i d = 150a i d = 75a v gs = 10v fig. 6. drain current vs. case temperature 0 10 20 30 40 50 60 70 80 90 -50 -25 0 25 50 75 100 125 150 175 t c - degrees centigrade i d - amperes external lead current limit fig. 5. r ds(on) norm alized to 0.5 i d25 value vs. drain current 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1 3.4 0 50 100 150 200 250 300 350 i d - amperes r d s ( o n ) - normalize d t j = 25 o c v gs = 10v t j = 175 o c v gs = 15v
ixtk 150n15p ixtq 150n15p ixys reserves the right to change limits, test conditions, and dimensions. fig. 11. capacitance 100 1,000 10,000 100,000 0 5 10 15 20 25 30 35 40 v ds - volts capacitance - picofarads c iss c oss c rss f = 1mhz fig. 10. gate charge 0 1 2 3 4 5 6 7 8 9 10 0 20 40 60 80 100 120 140 160 180 200 q g - nanocoulombs v g s - volts v ds = 75v i d = 75a i g = 10ma fig. 7. input admittance 0 25 50 75 100 125 150 175 200 225 250 44.5 55.5 66.5 77.5 88.5 v g s - volts i d - amperes t j = 150 o c 25 o c -40 o c fig. 8. transconductance 0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 175 200 225 250 i d - amperes g f s - siemens t j = -40 o c 25 o c 150 o c fig. 9. source current vs. source-to-drain voltage 0 50 100 150 200 250 300 350 0.4 0.6 0.8 1 1.2 1.4 1.6 v s d - volts i s - amperes t j = 150 o c t j = 25 o c fig. 12. forw ard-bias safe operating area 10 100 1000 10 100 1000 v d s - volts i d - amperes 100s 1ms dc t j = 175 o c t c = 25 o c r ds(on) limit 10ms 25s
? 2006 ixys all rights reserved ixtk 150n15p ixtq 150n15p fig. 13. m axim um trans ie nt the rm al re s is tance 0.01 0.10 1.00 1 10 100 1000 pulse width - milliseconds r ( t h ) j c - oc / w


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